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AXAREL 2200
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Formulated for removing solder pastes and flux residues, ionic contamination, and uncured SMD adhesives. Fast dry time. Compatible with most equipment designed for IPA.
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AXAREL 32
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Formulated for removing rosin, no-clean and lead-free solder paste and flux residues. Easy rinsing. Separates for water recycling.
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AXAREL 36
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Formulated for removing rosin, no-clean, lead-free solder paste and flux residues. Separates quickly for water recycling.
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BIOACT EC-15
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Formulated to remove high temperature lead-free solder paste and flux residues. Very low emissive loss and very high flash point.
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BIOACT EC-7
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The Original semi-aqueous defluxer. Designed to remove rosin and no clean solder pastes and flux residues. Excellent rinsing.
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BIOACT EC-78
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Made with new AquaEdge Technology. Highly recommended aqueous defluxer for lead-free, no-clean and high temp paste residues. Best aqueous defluxer for batch spray-in-air systems.
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BIOACT EC-7M
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Designed to remove solder paste and flux residues without rinsing. Can also remove uncured SMD adhesives. Bio-based and very low NVR.
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BIOACT EC-7R
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World's most popular semi-aqueous defluxer since 1991. Removes rosin and no-clean solder pastes and flux residues. Easy rinsing and separates quickly for water recycling.
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BIOACT EC-88
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Made with new AquaEdge Technology. Highly recommended aqueous defluxer for lead-free, no-clean and high temp paste residues. Best aqueous defluxer for inline spray systems.
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BIOACT EC-98
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Made with new AquaEdge Technology. Highly recommended aqueous defluxer for lead-free, no-clean and high temp paste residues. Best aqueous defluxer for ultrasonic systems.
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BIOACT EC-ULTRA
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Ideal for odor-sensitive environments. Formulated for rosin/resin flux residues. Bio-based, very low emissive loss, and high flash point.
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BIOACT SC-10
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Ideal alternative for isopropyl alcohol (IPA). Better than IPA in removing solder paste and flux residues, uncured SMD adhesive and ionic contamination including fingerprints. Eliminates white residue. Exceptional polarity, broad-based solvency.
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BIOACT SC-10E
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Designed to clean solder paste and uncured SMD adhesive from stencils without water rinse. Exceptional polarity and broad-based solvency.
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BIOACT SC-22
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Multi-purpose product designed to work well in wide variety of equipment applications. Highly effective in removing solder pastes and flux residues as well as uncured SMD adhesives. Does not require rinsing. May be diluted for use in aqueous processes.
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BIOACT SC-25
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Drop-in replacement for isopropyl alcohol (IPA). Better than IPA in removing flux and ionic contamination including white residue. Faster dry time and less odor than BIOACT SC-10.
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HYDREX AF
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Designed to reduce foaming caused by aqueous cleaning solutions, saponifiers and water-soluble flux residues. Effective anti-foaming agent for HYDREX DX. Non-silicone-based.
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HYDREX A-PLUS
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Aqueous immersion cleaner designed for heated stencil and misprint cleaning applications. Removes SMD adhesives and solder pastes. Neutral pH. Low odor. Non-flammable.
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HYDREX DX
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Low odor, VOC-free saponifer. Designed for difficult-to-clean rosin, no-clean and water-soluble solder pastes and flux residues.
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HYDREX LF
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Agressive MEA-based aqueous defluxer. This low foaming saponifer is designed to remove lead-free rosin, no-clean and water-soluble solder pastes and flux residues.
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HYDREX SP
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Designed for heated spray stencil and misprint cleaning. Removes solder pastes and SMD adhesives. Neutral pH, low VOC, low odor, non-flammable, and OSP-friendly
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HYDREX SP-50
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Stronger version of HYDREX SP for defluxing during misprint cleaning. Neutral pH and non-flammable.
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HYDREX WS
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Formulated to remove solder pastes and hard-to-clean uncured SMD adhesives without water rinsing. Approved for underwipe systems. Neutral pH, low odor. Non-flammable.
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LENIUM FEC
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Vapor degreasing solvent designed to remove solder paste and flux residues as well as ionic contamination from circuit assemblies and microelectronics. Higher TLV than LENIUM ES and non-ozone depleting. Contains no chlorinated or brominated solvents.
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LENIUM FRA
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Fluorinated rinsing agent in co-solvent and bi-solvent vapor degreasing. Non-ozone depleting, excellent plastic compatibility and high TLV. Contains no chlorinated or brominated solvents.
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MEGASOLV JB
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Organic solvent based defluxer specially designed for AAT Mega Clean II batch cleaner.
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MEGASOLV NOC
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Organic solvent based defluxer specially designed for AAT Mega Clean II system.
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SOLVAG ES
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Designed as a solvating agent in co-solvent and bi-solvent vapor degreasing. Formulated for removing polar soils. May also be used for non-vapor degreasing applications.
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SOLVAG SA-24
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Heavy duty solvent designed specifically for co-solvent and bi-solvent vapor degreasing. Removes baked-on flux residues as well as polar soils.
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